Sequans unveils new generation of mobile WiMAX chips

Sequans Communications, the world’s leading WiMAX chipmaker, has introduced its newest chip, the SQN1210, which for the first time integrates baseband and triple band RF in a single 65 nm die, leading to unprecedented achievements in size, cost, and performance.

“Our new chip delivers the highest level of integration yet achieved in the Mobile WiMAX industry,” said Georges Karam, Sequans CEO. “With both baseband and RF in a single 65nm die, the SQN1210 delivers industry leading low power consumption and high performance in the tiniest of chips, making it truly the best chip available today for mobile.”

Based on state-of-the-art 65 nm technology and four years of Sequans’ proven field experience, the new SQN1210 delivers dramatically reduced cost, power consumption, and size over previous generation technology in a tiny 10X10 package. Furthermore, the SQN1210 does not require external DRAM memory, and delivers maximum throughput of greater than 40 Mbps with extremely low power consumption of less than 350 mW with fully loaded MIMO traffic and less than 0.5 mW in standby. The integrated RF supports TDD and half duplex FDD and covers all three global WiMAX bands, 2.3, 2.5, and 3.5 GHz. The SQN1210 also supports 2 Tx, as specified in Release 1.5 of the WiMAX system profile, enabling uplink MIMO, a feature unique to Sequans that can nearly double cell coverage.

“Sequans’ SQN1210 single die solution marks a watershed event in the progress and maturity of the WiMAX ecosystem,” said Robert Syputa, partner and senior analyst, Maravedis. “The chip convincingly demonstrates that silicon to enable mobile devices and CPEs is no longer an obstacle to widespread adoption. This should be a signal to device manufacturers and operators to move forward to exploit markets despite the cautious economic

Feature highlights of Sequans SQN1210 SOC for Mobile WiMAX mobile stations

- 65 nm single die, baseband and triple band RF
- supports 2.3-2.4, 2.5-2.7, and 3.3-3.8 GHz bands
- TDD and H-FDD
- supports 2 Tx and uplink MIMO
- ultra low power consumption

Tagged as: CEO, georges karam, sequans, wimax chips

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